United Kingdom-Swindon: CSP25458 - Compact wafer bonder
Details
| Contract Title: | United Kingdom-Swindon: CSP25458 - Compact wafer bonder |
| Published Date: | Oct 23, 2025 |
| Notice Type: | Award (ContractAwardNotice) |
| Value Banding: | High Value |
| Delivery Point: | United Kingdom |
Description:
***** THIS IS A CONTRACT DETAILS NOTICE, NOT A CALL FOR COMPETITION ***** This procurement is being concluded following a limited competition procurement exercise. Contract details notice for the supply of Compact Vacuum Hot Flat Press for Wafer Bonding, Dry & Oil-Free Scroll Pump, Digital temperature controlled recirculating water chiller and delivery to UKRI...