Sub-Micron Die Bonder
Details
| Contract Title: | Sub-Micron Die Bonder |
| Published Date: | Dec 11, 2025 |
| Notice Type: | Notice (PriorInformationNotice) |
| Value Banding: | High Value |
| Delivery Point: | United Kingdom |
Description:
We are seeking equipment that can provide a wide range of bonding technologies to cater for semiconductor die to wafer, die to chip, wafer to wafer, fli-chip and other semiconductor chiplet bonding, to support our work in Heterogeneous Integration for Microelectronics and Semiconductor Systems....