Additional 4 Kits & Chipset
Details
| Contract Title: | Additional 4 Kits & Chipset |
| Published Date: | Feb 27, 2026 |
| Notice Type: | Award (ContractAwardNotice) |
| Value Banding: | High Value |
| Delivery Point: | United Kingdom |
Description:
4 vision/camera units to be built (comprised of 4 of each: CMOS sensor, PCB, DCDC converter and PWM driver ASIC), a CMOS sensors (without PCB and with DCDC converter) and a Serializer (also without PCB and with DCDC converter)....