Supply, Delivery and Installation of Backgrind Tape Laminator and De-Taping Kit
Details
| Contract Title: | Supply, Delivery and Installation of Backgrind Tape Laminator and De-Taping Kit |
| Published Date: | Aug 2, 2026 |
| Notice Type: | Notice (ContractNotice) |
| Value Banding: | High Value |
| Delivery Point: | United Kingdom |
Description:
Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Ce...