LA2974C- UCC- RFT for the Supply, Delivery and Installation of a Wafer Surface Planarisation System
Details
| Contract Title: | LA2974C- UCC- RFT for the Supply, Delivery and Installation of a Wafer Surface Planarisation System |
| Published Date: | Apr 13, 2025 |
| Notice Type: | Award (ContractAwardNotice) |
| Value Banding: | High Value |
| Delivery Point: | Ireland |
Description:
University College Cork request the supply of a Wafer Surface Planarisation System for use with semiconductor materials in wafer format. The required system will be used to level, planarise, the surface of a wafer following processing where complex layers and 3D structures have been built up. The system will be required to reduce surface height variation and surface roughness over a large area, i.e. a full wafer. The system will be required to process as wide a range of materials as possible, pa...