United Kingdom-Glasgow: Supply, Delivery, Installation & Commissioning of a Wafer Thinning Turnkey ITT
Details
| Contract Title: | United Kingdom-Glasgow: Supply, Delivery, Installation & Commissioning of a Wafer Thinning Turnkey ITT |
| Published Date: | May 21, 2025 |
| Notice Type: | Notice (ContractNotice) |
| Value Banding: | High Value |
| Delivery Point: | United Kingdom |
Description:
The University of Strathclyde has a requirement for a semiconductor wafer thinning capability suitable to receive wafers of various sizes and materials and grind, stress relieve and clean them before onward processing in a power semiconductor packaging line. The line will allow research to be performed on a variety of materials and processes involved in the manufacture of semiconductor products. This is in support of a publicly funded project that will see the creation of an advanced, scaleup p...